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      技術服務

      Design services

      來源: 發布時間:2016/4/15 16:21:48 瀏覽次數:0

         

      HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

          Package Design Team services include:

      ?  Customer-centric design.

      ?  High quality, reliable, and cost effective packaging proposal.

      ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

      ?  Supporting auto- check of design and Drawings.

      Design Capabilities:

         Multi-Chip ModulesMCM

         System-in-Package (SiP)

         Flip Chip Package

         Hybrid Package

         Package-in-Package (PiP)

         Package-on-Package (PoP)

         Embedded Package

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